Chip magazine india september 2012 pdf

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Cover Photo The ZEISS Xradia 520 Versa X-ray microscope (XRM) provides non-destructive package-level failure analysis and 3D volumetric and linear measurements on packaging structures with submicron resolution.

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(MELSS) have formed a strategic partnership to expand accessibility to Indium Corporation soldering materials throughout India.

YOJANA <u>September</u> <u>2012</u>

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The XRM system collects 2D projection images from the rotating sample, which is positioned between an X-ray source and detector, and then uses proprietary software to reconstruct 3D volume data that may be visualized and analyzed.

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And Siliconware Precision Industries Co., Ltd (SPIL).

Chip magazine india september 2012 pdf:

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